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On the analysis of physical properties of thermal interfaces based on hexagonal boron nitride and copper
https://doi.org/10.22349/1994-6716-2024-119-3-133-144
Abstract
The physical properties (thermal and thermal diffusivity) of thermal interfaces based on powdered boron nitride with a hexagonal crystal lattice (h-BN) and copper with a cubic crystal lattice (Cu) for cooling the electronic component base of micro- and nanoelectronics are studied. The physical properties are determined by the flash method. The prospects of using pressed hexagonal boron nitride powder as a thermal interface without using a binder are described. A comparison with the physical properties of other thermal interfaces that are widely used at present is made.
Supporting agencies: he work was carried out using the equipment of the Center for Collective Use (CCU) of the Russian Technological University (RTU MIREA) with the support of the Ministry of Education and Science of Russia. The study was supported by the grant of the Russian Science Foundation No 23-29-00079, https://rscf.ru/project/23-29-00079.
About the Authors
D. A. Prokhorov
MIREA – Russian Technological University; Federal State Unitary Enterprise “NAMI”
Russian Federation
Russian Federation
78 Vernadskogo Ave, 119454, Moscow
2 St Avtomotornaya 125438, Moscow
S. M. Zuev
MIREA – Russian Technological University; Federal State Unitary Enterprise “NAMI”
Russian Federation
Russian Federation
78 Vernadskogo Ave, 119454, Moscow
2 St Avtomotornaya 125438, Moscow
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Review
For citations:
Prokhorov D.A., Zuev S.M. On the analysis of physical properties of thermal interfaces based on hexagonal boron nitride and copper. Voprosy Materialovedeniya. 2024;(3(119)):133-144. (In Russ.) https://doi.org/10.22349/1994-6716-2024-119-3-133-144
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